Microfocus X Ray
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Unicomp एक्स-रे AX8300 प्लस सेमीकंडक्टर माइक्रोफोकस एक्स-रे निरीक्षण उपकरण
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 2 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel
Unicomp AX9180 180kV माइक्रोफोकस इलेक्ट्रॉनिक्स एक्स रे मशीन
यूनिकॉम्प AX9180: 10μm स्पॉट आकार, 60° झुकाव और 7-अक्ष लिंकेज के साथ 180kV माइक्रोफोकस एक्स-रे। उच्च-रिज़ॉल्यूशन एफपीडी सटीक पीसीबी, बीजीए और सेमीकंडक्टर निरीक्षण के लिए 1000X आवर्धन प्रदान करता है। इसमें 1 साल की वारंटी और ऑफ़लाइन प्रोग्रामिंग शामिल है।
IC हाई इमेज रेजोल्यूशन Unicomp Weld X Ray निरीक्षण मशीन माइक्रोफोकस
Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
130kV माइक्रोफोकस यूनिकॉम्प एक्स रे AX9100 श्रीमती एलईडी BGA QFN Voids मापन के लिए:
130kV Microfocus X Ray Inspection Machine Unicomp AX9100 For SMT LED BGA QFN Voids measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition
AX9100 130kV माइक्रोफोकस इलेक्ट्रॉनिक्स एक्स रे मशीन FPD ओब्लिक व्यू 360 रोटेशन टेबल के साथ:
AX9100 130kV microfocus X-ray with FPD oblique view and 360°rotation table for electronic components check Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of Unicomp AX9100: ● SMT, BGA, CSP, Flip
ऑटोमोटिव कनेक्टर के लिए 130kV माइक्रोफोकस AX9100 Unicomp X Ray
130kV Microfocus X-ray AX9100 for automotive connector inner connection quality defect wire broken inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,
आईसी सेमीकंडक्टर यूनिकॉम्प एक्स रे हाई मैग्नीफिकेशन माइक्रोफोकस AX9100 130KV
Directly factory supply of microfocus X Ray System AX9100 with high magnification for IC Semiconductor Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification,
हाई पावर पीसीबी एक्स रे मशीन एक्स रे यूनिकॉम एएक्स 8300 एलईडी के लिए
High power X ray sources PCB X Ray Machine Unicomp AX8300 for LED X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Major applications: PCBA BGA/IC LED Aliminum die casting Battery connector inspecting 1. Semiconductor package 2. Electronic connector module. 3.
सेमीकॉन आईसी चिप्स के लिए एचडी एफपीडी इलेक्ट्रॉनिक्स एक्स रे मशीन 1.3 किलोवाट
HD FPD Electronics X Ray Machine 1.3kW For Semicon IC Chips Microfocus X Ray machine with HD FPD for semicon IC chips wire sweep broken defect Inspection Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm
