bga x ray inspection system
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एलईडी लाइटिंग के लिए लाइनक्स रे बैगेज इंस्पेक्शन सिस्टम सीएनसी मोशन कंट्रोल मोड
In-line X-Ray Inspection Machine for LED Lighting Unicomp Technology upholds its Integrity, Deploitation and Excellence in the business, is committed to meeting the highest level of International Standards and promises to be a responsive partner with all of our customers. This philosophy has enabled Unicomp to generated a strong Global customer base of many International Renowned companies including Flextronics, Foxconn, Samsung, Philips, GM, Bosch, Emerson, Delphi,ABB, BYD,
बीजीए क्यूएफएन सोल्डरिंग के लिए इनलाइन एसपीसी इलेक्ट्रॉनिक्स एक्स रे मशीन एलएक्स 2000 एफपीसी का विश्लेषण करना
Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.
एफपीसी एसएमटी सोल्डरिंग के लिए बीजीए क्यूएफएन सीएसपी एक्स रे उपकरण एलएक्स 2000 सीएनसी प्रोग्राम करने योग्य:
LX2000 inline x-ray equipment with CNC programmable inspection for FPC SMT soldering process of BGA , QFN, CSP parts Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed
पीसीबीए बीजीए एलईडी क्यूएफएन एक्स रे स्कैनिंग मशीन यूनिकॉम्प AX7900 सेमीकंडक्टर के लिए
High resolution micofocus X-Ray machine Unicomp AX7900 for SMT EMS PCBA BGA LED QFN soldering Void quality check Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max
AX7900 यूनिकॉम्प एक्स रे मशीन श्रीमती पीसीबी पीसीबीए बीजीए निरीक्षण उच्च संकल्प
Unicomp AX7900 X-Ray machine with high resolutions FPD for SMT Printed circuit board PCBA BGA inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
पीसीबीए यूनिकॉम्प एक्स रे मशीन AX7900 बीजीए डाई बॉन्ड वायर निरीक्षण के लिए उच्च संकल्प एफपीडी
PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection Description of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection
हार्नेस केबल कनेक्टर के लिए ईएमएस बीजीए 90 केवी 5um एनडीटी एक्स रे उपकरण एफपीडी
Real Time close tube 90kV 5um X-ray Equipment with FPD for Wire Harness cable connector inner quality inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max
ईजीएस सेमीकंडक्टर इलेक्ट्रोनिक्स एक्स रे मशीन सिस्टम बीजीए और सीएसपी इंस्पेक्शन के लिए
EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
समझाया अवयव प्रतिरोध इलेक्ट्रॉनिक्स एक्स रे मशीन 5μm स्पॉट आकार
Factory Manufacturing X Ray Machine 5μM For Resistance Applications Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components EMS Semiconductor Electronics X Ray Machine System for BGA and CSP
