bga x ray inspection system
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इलेक्ट्रॉनिक्स श्रीमती पीसीबीए बीजीए आईसी सोल्डरिंग गुणवत्ता जांच के लिए यूनिकॉम्प AX8500 110kV 5um 2.5D एक्स-रे
Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
सेमीकंडक्टर उच्च संकल्प वेल्डिंग एक्स रे मशीन 90KV 5um
90kV 5um High Resolution And Long Lifespan X-Ray Machine For SMD PCBA Soldering Qualtiy Inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and
श्रीमती बीजीए इलेक्ट्रॉनिक्स एक्स रे मशीन एफपीडी 1000X आवर्धन यूनिकॉम्प AX8500
Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel
इलेक्ट्रॉनिक्स आंतरिक दोष निरीक्षण के लिए AX7900 रीयल टाइम डिजिटल एक्स रे मशीन
AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
इलेक्ट्रॉनिक्स आंतरिक दोष निरीक्षण के लिए AX7900 रीयल टाइम ऑटो ऑफ़लाइन एक्स रे मशीन
AX7900 Real Time Auto-Offline X Ray Machine For Electronics Inner Defect Inspection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power
सटीक पीसीबीए निरीक्षण और एसएमटी अनुप्रयोगों के लिए आर2आर-सक्षम सीएक्स3000 डेस्कटॉप एक्स-रे सिस्टम
Brand New Generation of CX3000 with Reel to Reel Function Making It More Competitive FEATURES of Desktop X-ray machine 1. 5μm 100kV X-ray tube; 2. Dynamic FPD with a high resolution of 1000×1124; 3. Equipped with 360° rotary fixture to eliminate PoP shadow; 4. The detection area is easily positioned by an external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock, and emergency button.
श्रीमती पीटीएच सोल्डरिंग भरने की दर और बीजीए शून्य निरीक्षण के लिए उच्च प्रदर्शन एक्स-रे मशीन AX9100
High Performace X-ray Machine AX9100 for SMT PTH soldering filling rate and BGA Void inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
PCBA BGA CSP QFN के लिए सीएनसी प्रोग्रामिंग एक्स रे डिटेक्टर स्वचालित
Automatic Measurement With CNC Programming X-Ray Equipment For PCBA BGA CSP QFN Reflow Soldering Quality Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Test Images: Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 5μm X-Ray tube. ●
सीएसपी एलईडी बेंचटॉप एक्स रे मशीन 0.8KW यूनिकॉम्प AX7900 DXI सिस्टम
Venous Indwelling needle inside assembly quality inspection by Unicomp AX7900 X-ray machine Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm
