bga x ray machine
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AC 110-220V X रे फ्लेव स्क्रीनिंग मशीन 0.8kW पॉवर फॉर व्हीकल एलईडी लाइटिंग
Electronics X Ray Machine for BGA , CSP , LED , Flip Chip , Semiconductor OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to support you. 6
श्रीमती बीजीए सोल्डरिंग शून्य आईसी गुणवत्ता निरीक्षण के लिए यूनिकॉम्प AX7900 90kV एक्स रे निरीक्षण मशीन
Unicomp AX7900 90kV X ray inspection machine for SMT BGA soldering void IC quality inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
उच्च गुणवत्ता वाली 90kV एक्स रे निरीक्षण मशीन Unicomp AX7900
High quality 90kV X ray inspection machine Unicomp AX7900 for BGA quality accuracy testing Description of IC X Ray machine AX7900: It finds widespread application in industries like BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductors, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among various others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise
एफपीसी एसएमटी सोल्डरिंग के लिए बीजीए क्यूएफएन सीएसपी एक्स रे उपकरण एलएक्स 2000 सीएनसी प्रोग्राम करने योग्य:
LX2000 inline x-ray equipment with CNC programmable inspection for FPC SMT soldering process of BGA , QFN, CSP parts Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed
श्रीमती ईएमएस बीजीए एलईडी सीएसपी क्यूएफएन सोल्डरिंग के लिए यूनिकॉम्प AX8500 एक्स रे निरीक्षण मशीन
Unicomp AX8500 X-ray inspection machine for SMT / EMS BGA LED CSP QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
130kV माइक्रोफोकस यूनिकॉम्प एक्स रे AX9100 श्रीमती एलईडी BGA QFN Voids मापन के लिए:
130kV Microfocus X Ray Inspection Machine Unicomp AX9100 For SMT LED BGA QFN Voids measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition
सीएनसी समारोह के साथ वाहन प्रकाश यूनिकॉम्प एक्स रे 60 डिग्री झुकाव गति
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
वाहन एलईडी लैंप के लिए सोल्डर क्वालिटी एक्स-रे डिटेक्शन एक्स-रे सिस्टम
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
1.6kW ऑफ़लाइन प्रोग्रामिंग Unicomp X Ray AX9100 कनेक्टर के लिए
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Offline programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
