electronics x ray system
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माइक्रो फोकस इलेक्ट्रॉनिक्स एक्स रे सिस्टम एसएमटी इलेक्ट्रॉनिक्स आंतरिक दोष नियंत्रण
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
एल्गोरिथ्म एफपीडी इलेक्ट्रॉनिक्स एक्स रे मशीन 1.0kW एलईडी रिफ़्लो सोल्डर के लिए
Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3
BGA CSP / QFN / PoP शून्य निरीक्षण के लिए उच्च आवर्धन इलेक्ट्रॉनिक्स X Ray सिस्टम
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
सीएनसी प्रोग्रामेबल डिटेक्शन इलेक्ट्रॉनिक्स एक्स रे मशीन गोल्फ बॉल इनर क्वालिटी इंस्पेक्शन
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
मल्टी फंक्शन इलेक्ट्रॉनिक्स एक्स रे मशीन हाई स्पीड रियल टाइम फॉर गोल्ड बॉल
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
पीसीबी BGA निरीक्षण इलेक्ट्रॉनिक्स एक्स रे मशीन गोल्फ बॉल गुणवत्ता की जाँच के अंदर
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
एलसीडी मॉनिटर कैपेसिटर इलेक्ट्रॉनिक एक्स रे स्कैनर मशीन 24 "उच्च परिशुद्धता
High Precision X Ray Machine 24" LCD Monitor Capacitor Inspection Application Function & Features Large Size Inspection Table Laser Locator for Precise Location 24’’ FHD Interactive Touch LCD Display Fingerprint Access Management System Real-time Monitoring of Radiation Accurate Control, CNC ProgrammingAutomatic Positioning FPD 60° Tilting Inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small
सीएनसी प्रोग्रामेबल स्वचालित निरीक्षण इलेक्ट्रॉनिक्स एक्स-रे मशीन आईसी वक्रता मापने के लिए 60° झुकाव कोण के साथ AX9100MAX
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
AX9100max इलेक्ट्रॉनिक्स एक्स रे मशीन FPD झुकाव के दौरान फिक्स्ड-पॉइंट फॉलोइंग के साथ
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
