electronics x ray system
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ईएमएस श्रीमती पीसीबी इलेक्ट्रॉनिक्स एक्स रे मशीन बीजीए क्यूएफएन एलईडी सोल्डरिंग शून्य एनडीटी निरीक्षण उपकरण
Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, ...
2.5 एक्स टाइटलिंग इलेक्ट्रॉनिक्स एक्स रे मशीन 6 एक्सिस मूवमेंट के साथ 40 डब्ल्यू रोटेशन 360 °
Application SMT, BGA, CSP, Flip Chip, LED Detection, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Features Tilt detection with 55° and rotation 360°operation ...
माइक्रो फोकस इलेक्ट्रॉनिक्स एक्स रे सिस्टम एसएमटी इलेक्ट्रॉनिक्स आंतरिक दोष नियंत्रण
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area ...
एल्गोरिथ्म एफपीडी इलेक्ट्रॉनिक्स एक्स रे मशीन 1.0kW एलईडी रिफ़्लो सोल्डर के लिए
Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables...
सीएनसी प्रोग्रामेबल स्वचालित निरीक्षण इलेक्ट्रॉनिक्स एक्स-रे मशीन आईसी वक्रता मापने के लिए 60° झुकाव कोण के साथ AX9100MAX
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
BGA CSP / QFN / PoP शून्य निरीक्षण के लिए उच्च आवर्धन इलेक्ट्रॉनिक्स X Ray सिस्टम
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area ...
सीएनसी प्रोग्रामेबल डिटेक्शन इलेक्ट्रॉनिक्स एक्स रे मशीन गोल्फ बॉल इनर क्वालिटी इंस्पेक्शन
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high ...
मल्टी फंक्शन इलेक्ट्रॉनिक्स एक्स रे मशीन हाई स्पीड रियल टाइम फॉर गोल्ड बॉल
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and ...
पीसीबी BGA निरीक्षण इलेक्ट्रॉनिक्स एक्स रे मशीन गोल्फ बॉल गुणवत्ता की जाँच के अंदर
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area ...
