pcb x ray inspection
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क्यूएफएन सीएसपी के लिए 90kV 5um सीएनसी प्रोग्राम करने योग्य एक्स रे मशीन AX8200MAX
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 90kV/100kV Max.Power 8W Spot Size 5μm X-ray System Intensifier 4"Image Intensifier Monitor 22"LCD System Magnification 600x Detection Region Max.Loading Size 510mm x 420mm Max.Inspection Area 435mm x 385mm X-ray Leakage < 1uSv/h OUR SERVICE
केबल कनेक्टर के लिए सीएसपी इलेक्ट्रॉनिक्स एक्स रे मशीन UNICOMP CX3000
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high
एसएमटी एलईडी सोल्डरिंग के लिए 90kV बंद ट्यूब 0.8kW एक्स रे सिस्टम
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
BGA CSP के लिए Unicomp AX8200 100KV X Ray स्कैनिंग मशीन
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
श्रीमती पीसीबीए बीजीए सीएसपी के लिए 90kV 5um यूनिकॉम्प एक्स रे स्कैनर मशीन
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application fields
मल्टीफ़ंक्शन इलेक्ट्रॉनिक्स एक्स रे मशीन, बैटरी उद्योग के लिए बीजीए एक्स रे निरीक्षण प्रणाली
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
इलेक्ट्रॉनिक्स एक्स-रे निरीक्षण मशीन AX7900 यूनिकॉम्प 5μm माइक्रो फोकस ऑटो वॉयड डिटेक्शन BGA सोल्डर उच्च परिशुद्धता
Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent
ऑटो रिजेक्टर के साथ ताजा मांस के अंदर विदेशी मामलों की जांच के लिए खाद्य एक्स रे निरीक्षण मशीन
Food X ray inspection machine for checking foreign matters inside fresh meat with auto rejector APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass,
