x ray detection equipment
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MOSFET शून्य जांच और विश्वसनीयता विश्लेषण AX8300MAX के लिए यूनिकॉम्प 110KV एक्स-रे निरीक्षण
Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task
इनलाइन एनडीटी एक्स रे उपकरण 2.8 एलपी / एमएम व्हील हब के लिए संकल्प परीक्षण / निरीक्षण प्रणाली का पता लगाएं
Inline X-Ray Testing & Inspection Equipment & Systems for wheel hub Unicomp Technologies is a global supplier of innovative solutions for x-ray inspection and non-destructive testing (NDT). The unicomp systems are based on leading-edge x-ray and vision technology and ensure the fulfilment of customers' quality requirements. Unicomp Technologies’ product portfolio encompasses real-time failure analysis, including standardised systems for manual and automatic x-ray inspection,
पैक बल्क के लिए यूनिकॉम्प एक्स-रे इंसेप्शन सिस्टम विदेशी पदार्थ संदूषण जांच कर सकता है
Unicomp X-ray insepction system for pack bulk can food foreign matter contamincation check APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass, bone,
22 "एलसीडी मॉनिटर एसएमटी ईएमएस सोल्डरिंग इलेक्ट्रॉनिक निरीक्षण उपकरण उच्च रिज़ॉल्यूशन की कमी
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending,
माइक्रो फोकस इलेक्ट्रॉनिक्स एक्स रे सिस्टम एसएमटी इलेक्ट्रॉनिक्स आंतरिक दोष नियंत्रण
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
आंतरिक दोष का पता लगाने के लिए सेमीकंडक्टर श्रीमती बागा एक्स रे निरीक्षण प्रणाली
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 7µm closed X-ray tube, high speed &
BGA CSP / QFN / PoP शून्य निरीक्षण के लिए उच्च आवर्धन इलेक्ट्रॉनिक्स X Ray सिस्टम
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
मल्टी फंक्शन इलेक्ट्रॉनिक्स एक्स रे मशीन हाई स्पीड रियल टाइम फॉर गोल्ड बॉल
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
पीसीबी BGA निरीक्षण इलेक्ट्रॉनिक्स एक्स रे मशीन गोल्फ बॉल गुणवत्ता की जाँच के अंदर
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
