x ray imaging system
"
सीएनसी प्रोग्रामेबल कंट्रोल एक्स रे मशीन 8KW यूनिकॉम्प UNC225
Cast Parts Industrial X Ray Machine Real Time Imaging Inspection UNC225 UNC225 is a robust, reliable industrial X-ray inspection system for broad applications in foundries, R&D, laboratories, universities, and educational institutions. The system delivers brilliant image quality with digital flat-panel detector and highly dynamic radioscopy. Smart ergonomics for easy operation Tailor-made configuration for wheels and tires Renowned, robust, reliable digital X-ray inspection
इलेक्ट्रॉनिक घटकों के आंतरिक दोष निरीक्षण के लिए यूनिकॉम्प एक्स-रे प्रणाली AX9100max
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
इलेक्ट्रॉनिक्स आईसी घटकों के लिए उच्च आवर्धन पीसीबी एक्स-रे मशीन Unicomp AX9100MAX
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
सीएनसी प्रोग्रामेबल स्वचालित निरीक्षण इलेक्ट्रॉनिक्स एक्स-रे मशीन आईसी वक्रता मापने के लिए 60° झुकाव कोण के साथ AX9100MAX
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
एसएमटी पीसीबी एक्स-रे मशीन बीजीए खोखलेपन के माप के लिए माइक्रोन फोकस स्पॉट का आकार और चढ़ाई ऊंचाई निरीक्षण के बाद मिलाप
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
पीसीबी और बीजीए निरीक्षण के लिए दोहरी कंप्यूटर के साथ 130 केवी माइक्रोन फोकस स्पॉट साइज ट्यूब एक्स-रे मशीन AX9100MAX
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
इलेक्ट्रॉनिक बोर्ड 2 डी और 2.5 डी एक्स-रे मशीन AX9100MAX 360 डिग्री रोटेशन टेबल के साथ BGA&PCB के लिए
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
ब्रेक पैड में आंतरिक दोषों का पता लगाने के लिए यूनिकॉम्प UNC160 NDT एक्स-रे उपकरण
Unicomp UNC160 X-Ray for detecting internal defects in brake pads Product Description: Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features: Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection with international standard, multiple safety set up Image Proccessing:
यूनिकॉम्प UNC160 एक्स-रे उपकरण के साथ ब्रेक पैड में आंतरिक दोषों का पता लगाएं
Detect Internal Flaws in Brake Pads with Unicomp UNC160 X-Ray Product Description: Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features: niversal Applications: Capable of inspecting large sizes and heavy loads. Safety Compliance: Meets international standards with robust safety measures. Image Processing: High-quality, swift
