x ray inspection system
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क्रैक पोरसिटी के लिए डिजिटल एनडीटी रेडियोग्राफी उपकरण यूनिकॉम्प UNC160 एक्स रे मशीन
Digital Radiography Unicomp UNC160 X ray machine for Electric insulator Non-destructive testing of crack porosity System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work environment 5-40° ≤80%HR Install power Three-phase five-wire system AC380V X-ray leakage dose rate ≤1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area
UNC160 3.0LP / मिमी 6kW एपॉक्सी राल निरीक्षण मशीन
Micro Matrix Heat Exchangers or MMX UNC160 X-ray Inspection Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● Multi-functional workstation,360°rotation and shift; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development requirement. Applications: ● Cast parts and pressure Vessels ● Epoxy Resin Defect Detection ● Wheel,Tires and
औद्योगिक एक्स रे इमेजिंग सिस्टम सबकम्रॉन फोकल स्पॉट आकार के साथ 80kV / 90kV स्रोत
Metal X Ray Machine 80kV / 90kV source with submicron focal spot size FEATURES: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm, max. detection area 380 x 380mm,
300kg Benchtop एक्स रे मरो कास्टिंग के लिए मशीन उच्च शुद्धता निरीक्षण
High accuracy inspection Benchtop Electronics PCBA Unicomp X-ray Machine The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage
सीएनसी प्रोग्रामयोग्य 5um 2.5D एक्स-रे मशीन यूनिकॉम्प AX7900 श्रीमती PCBA BGA सोल्डरिंग के लिए स्वचालित रूप से माप से बचा जाता है
CNC programmable 5um 2.5D X-Ray machine Unicomp AX7900 for SMT PCBA BGA soldering voids automatically measurement Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines.
माइक्रो फोकस एक्स रे सेमीकंडक्टर निरीक्षण उपकरण इनलाइन 2D
Factory directly supply microfocus inline 2D X-ray machine to check Electronic Semiconductor IGBT with automatic defect recognition Technical Parameters and SpecificationsSystem SummaryFootprint2595(W)×1392(D)×1992(H)mmMachine Weight1900 kg (X-Ray) / 700kg (Conveyor)Power SupplyAC 110~220V, 50/60HzPlywood Packing Size180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor)Packing Weight2000kg (X-Ray) / 800kg (Conveyor)Power Consumption3.5 kWX-Ray TubeTube TypeSealedMa
स्विच आंतरिक दोष निरीक्षण के लिए AX7900 रीयल टाइम डिजिटल एक्स रे मशीन
Real Time Digital X-Ray Machine AX7900 for Switch Inner Defects Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz
इलेक्ट्रॉनिक्स आंतरिक दोष निरीक्षण के लिए AX7900 रीयल टाइम डिजिटल एक्स रे मशीन
AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
इलेक्ट्रॉनिक्स आंतरिक दोष निरीक्षण के लिए AX7900 रीयल टाइम ऑटो ऑफ़लाइन एक्स रे मशीन
AX7900 Real Time Auto-Offline X Ray Machine For Electronics Inner Defect Inspection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power
