industrial inspection systems
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धातु उत्पादों के लिए औद्योगिक एनडीटी एक्स रे मशीन UNC160 आंतरिक दोष निरीक्षण
Industrial NDT X-Ray inspection machine UNC160 specialized in internal defect inspection for Metal products Applications of NDT X-ray Machine UNC160: ● Cast parts and Pressure Vessels ● Steel pipe, Cylinder, and Wood ● Epoxy Resin Defect Detection ● Wheel, Tires, and Metal parts FAQ: 1. How about the package? Is it safe during the delivery? All X-ray inspection machine is packed with standard wooden solid carton. It is safe when shipping. 2. Do you provide the Warranty? How
सीई/एफडीए प्रमाणित एफपीडी 90 केवी कैपेसिटर दोषों का पता लगाने के लिए एक्स-रे निरीक्षण प्रणाली
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, PCB, Flip Chip, LED, Fuse, Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
पीसीबी नियंत्रण के लिए सटीक एक्स-रे निरीक्षण एक्स-रे रिसाव 1uSv/h वोल्टेज 0-110kV समायोज्य
X-Ray Inspection for PCB Quality Control Application of SMT X-Ray machine Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of Desktop X-ray machine Large Size Inspection Table with 360° rotation Laser Locator for Precise Location Maganification (1000X) Accurate Control, CNC Programming Automatic Positioning FPD 55°
हाई डेफिनिशन 2.5D इमेजिंग ओवरलैप्ड वॉयड BGA एक्स-रे AX9100 UNICOMP SMT असेंबली निरीक्षण उपकरण
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment Product Overview The Unicomp AX9100 represents advanced X-ray inspection technology for comprehensive SMT assembly quality control, featuring high-definition 2.5D imaging and specialized void detection capabilities for BGA components. Key Features 130KV 7μm X-Ray tube for precise imaging High-speed, high-resolution FPD with millions of pixels 1000X magnification with high
ओमनी-दिशात्मक बॉन्ड वायर निरीक्षण आईसी एक्स-रे AX9100 UNICOMP प्रेसिजन घटक परीक्षण मशीन
Omni-directional Bond Wire Inspection IC X-ray AX9100 UNICOMP Precision Component Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with
बीफ़ चिकन और मांस के लिए 0.2 मिमी उच्च संवेदनशीलता यूनिकॉम्प UNX6030 एक्स रे निरीक्षण मशीन
UNX6030-N X-ray Inspection Machine The UNX6030-N is a compact X-ray inspection system specifically engineered for lightweight, small-bag packaged products. Optimized with advanced detection algorithms for low-density and thin-layer materials, this model excels at identifying and rejecting physical contaminants that traditional metal detectors often miss. Core Application Areas Confectionery & Snacks: Chocolates, hard/soft candies, biscuits, baked bread, and extruded potato
इलेक्ट्रॉनिक्स आईसी घटकों के लिए उच्च आवर्धन पीसीबी एक्स-रे मशीन Unicomp AX9100MAX
High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery
इलेक्ट्रॉनिक्स एसएमटी बीजीए एक्स-रे निरीक्षण प्रणाली 130 केवी सीएसपी एलईडी ऐक्स 9100, 1 9 00 किलो
Electronics SMT BGA X-ray Detection Equipment 130KV CSP LED AX9100 Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● 7 axis linkage, 70 degree tilt detection. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ●
एसी 110 ~ 220V बागा निरीक्षण उपकरण श्रीमती रिज़ॉल्यूशन FPD डिटेक्टर के लिए श्रीमती औद्योगिक
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor, Packaging components, Battery Industry, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing system, CNC programmable detection X-ray tube & detector automatic lifting and descending, with convenient
