industrial inspection systems
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डायमंड कोर ड्रिल बिट के लिए यूनिकॉम्प AX8200B 100kv एक्स रे स्कैनर मशीन 5μM
X-ray Inspection for Diamond core drill bit inner distance measurement by Unicomp AX8200B Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This
डायमंड कोर ड्रिल बिट के लिए सीएसपी AX8200B एक्स रे डिटेक्ट उपकरण 0.8KW:
Factory price high quality AX8200B X-RAY inspection for diamond core drill bit inner dimension measurement Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing
सील ट्यूब यूनिकॉम्प एक्स रे इंटरएक्टिव टच 90kV बेंचटॉप इंडवेलिंग सुई के लिए
Unicomp Factory directly supply of 90kV X-ray machineto find medical indwelling needle inside crack defects Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control,
इलेक्ट्रॉनिक्स के लिए माइक्रोफोकस 2.5D यूनिकॉम्प एक्स रे AX8200 मैक्स 5um 6 एक्सिस मैनिपुलेटर
Unicomp AX8200Max 5um microfocus 2.5D X Ray Machine with 6 Axis Manipulator For Automotive electronics quality checking Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3.
ऑटोमोटिव इलेक्ट्रॉनिक्स के लिए ट्यूब यूनिकॉम्प एक्स रे AX8200 मैक्स 5μM बंद करें
Using Unicomp AX8200Max close tube Microfocus X-ray to detect Automotive electronics inner quality defects Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control,
ऑफलाइन AX8200Max SMT EMS एक्स रे मशीन ऑटो मैपिंग माप
Offline AX8200Max SMT EMS X Ray Machine Auto Mapping Measurement Unicomp offline AX8200Max X-ray with auto-mapping and measurement for BGA QFN LED soldering Void Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot
एल्यूमिनियम कास्टिंग के लिए क्रॉस ओवर मैनिपुलेटर के साथ यूनिकॉम्प यूएनसी 320 एनडीटी एक्स रे उपकरण
Automotive steering knuckle aluminum casting tested by Unicomp NDT X-Ray UNC320 with Cross Over manipulator X-ray flaw detection is the difference in the degree of X-ray absorption by using different thicknesses of materials. By using X-ray fluoroscopy and industrial television real-time imaging, the internal defects of materials, parts, and welds are revealed from the film and the image. Such as cracks, shrinkage cavities, pores, slag inclusions, unmelted, incomplete
इलेक्ट्रॉनिक्स सेमीकंडक्टर के लिए छोटे पदचिह्न डेस्कटॉप एक्स रे मशीन कॉम्पैक्ट पोर्टेबल
Unicomp CX3000 Small footprint compact portable Desktop X-ray Machine For Electrnoics Semiconductor Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x
PCBA BGA QFN के लिए Unicomp AX8200MAX 2.5D X रे मशीन ऑटो मापन
Unicomp AX8200MAX 2.5D X-ray machine for PCBA BGA QFN soldering voids Auto measurement Application Fields of AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of AX8200max 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate
