metal detector x ray machine
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सीएसपी एलईडी एक्स रे मशीन बंद ट्यूब फ्लिप चिप AX8500 100KV सेमीकंडक्टर के लिए
Closed Tube Type AX8500 X Ray Machine for semiconductor Lead frame wiring bonding quality inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
इलेक्ट्रॉनिक्स आईसी घटकों के लिए उच्च आवर्धन पीसीबी एक्स-रे मशीन Unicomp AX9100MAX
High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery
उच्च घनत्व धातु दोष एक्स रे डिटेक्टर उपकरण यूनिकंप सामान्य 225 केवी
General 225KV High Density Metal Flaw X Ray Detector Equipment Unicomp Non Destructive Testing (NDT) is an important part of industrial quality management. Many Digital Radiography (DR) standards like the EN-17636 or NADCAP demand a high accuracy and reliable archiving of test-results. Unicomp has years long experience with many different applications and industries. As requirements vary between industries and even companies all systems can be easily customized and adapted.
80-350 मिमी ऑर्बिट समायोजन रेंज के साथ अत्यधिक लचीला एसएमटी / ईएमएस एक्स रे मशीन
Highly flexible and costeffective electronics Metal X Ray Machine High resolution x-ray images are generated using a closed microfocus 130kV tube with leading edge FPD (Flat Panel Display) detectors. This imaging chain combination is excellent for multiple applications including; PCBA, Semiconductor, Encapsulated Components, and Solar Cell just to name a few. Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumptio
Unicomp AX9100max X-ray Machine High-Performance for IGBT Inspection in Various Industries
Unicomp AX9100max X-ray Machine High-Performance for IGBT Inspection in Various Industries Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA Unicomp AX9100max X-ray Machine The AX9100max is a high-performance X-ray inspection system specially designed for IGBT inspection and other advanced applications. It is widely used across multiple industries, including: Semiconductors: BGA, CSP, Flip Chip, Diode, IGBT Electronics: LED, PCB, Fuse, Connector Modules, Cables Energy & Power
सेमीकंडक्टर उच्च संकल्प वेल्डिंग एक्स रे मशीन 90KV 5um
90kV 5um High Resolution And Long Lifespan X-Ray Machine For SMD PCBA Soldering Qualtiy Inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and
यूनिकॉम्प AX9100max एक्स-रे मशीन 130kV 65W BGA के लिए
Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields of Unicomp AX9100max X-ray Machine Functions and Features Functions and features of Unicomp AX9100max X-ray
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and finds broad application across industries such as BGA/CSP/Flip Chip packaging, LED and optoelectronic component manufacturing, fuse and diode production, PCB and semiconductor assembly, battery fabrication, small metal casting inspection, electronic connector modules and cable testing, and photovoltaic (PV) cell quality
प्रयुक्त मोबाइल फोन गुणवत्ता निरीक्षण के लिए उच्च आवर्धन एक्स-रे मशीन Unicomp AX7900
High magnifications X-ray machine Unicomp AX7900 for used mobile phone quality inspection Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location Accurate Control, CNC Programming Automatic
