pcb inspection equipment
"
पीसीबीए माइक्रो फोकस डेस्कटॉप एक्स रे मशीन एफपीडी इंटेन्सिफायर, 48 मिमी एक्स 54 मिमी एक्स-रे कवरेज
Benchtop Electronics PCBA micro-focus BGA X Ray Inspection Machine OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to customers, with competitive price. 3.We provide one year warranty, free training and whole life technology support. 4.We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5.Well-trained and Professional after-sales service team to support you. 6.Manual will
पीसीबी BGA निरीक्षण इलेक्ट्रॉनिक्स एक्स रे मशीन गोल्फ बॉल गुणवत्ता की जाँच के अंदर
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
बीजीए क्यूएफएन सोल्डरिंग के लिए इनलाइन एसपीसी इलेक्ट्रॉनिक्स एक्स रे मशीन एलएक्स 2000 एफपीसी का विश्लेषण करना
Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.
सीई/एफडीए प्रमाणित एफपीडी 90 केवी कैपेसिटर दोषों का पता लगाने के लिए एक्स-रे निरीक्षण प्रणाली
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, PCB, Flip Chip, LED, Fuse, Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
7μm इमेजिंग आईसी बॉन्डिंग वायर ब्रेक एक्सरे AX9100 UNICOMP सेमीकंडक्टर चिप पैकेजिंग परीक्षण उपकरण
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with
उच्च संकल्प इलेक्ट्रॉनिक्स एक्स रे मशीन, आईसी एलईडी क्लिप्स इलेक्ट्रॉनिक उपकरणों डिटेक्टर
IC LED Clips Electronic Components Detector Electronics X Ray Machine X-ray Inspecting Features: (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray. (2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB
पीसीबीए बीजीए क्यूएफएन एलईडी सोल्डरिंग शून्य का निरीक्षण करने के लिए एफपीडी 55 डिग्री झुकाव दृश्य के साथ 5μm माइक्रोफोकस एक्स-रे
5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
सीएनसी समारोह के साथ वाहन प्रकाश यूनिकॉम्प एक्स रे 60 डिग्री झुकाव गति
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
कैपेसिटर आंतरिक दोष निरीक्षण के लिए वास्तविक समय डिजिटल एक्स-रे मशीन AX7900
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
