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गुणवत्ता यूनिकॉम्प AX8200Max 90kv 5um एक्स-रे मशीन आईसी वायर स्वीपिंग टूटी दरार परीक्षण के लिए कारखाना

यूनिकॉम्प AX8200Max 90kv 5um एक्स-रे मशीन आईसी वायर स्वीपिंग टूटी दरार परीक्षण के लिए

Unicomp AX8200Max 90kv 5um X-ray machine for IC wire sweeping broken cracks testing Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming

गुणवत्ता सेमीकॉन लीडफ्रेम परीक्षण के लिए 5 माइक्रो क्लोज्ड ट्यूब 90kv एक्स-रे मशीन Unicomp AX8200Max कारखाना

सेमीकॉन लीडफ्रेम परीक्षण के लिए 5 माइक्रो क्लोज्ड ट्यूब 90kv एक्स-रे मशीन Unicomp AX8200Max

5 micro closed tube 90kv X-ray machine Unicomp AX8200Max for semicon leadframe testing Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming

गुणवत्ता वाहन एलईडी लैंप के लिए फ्लेवर डिटेक्टर एक्स रे निरीक्षण प्रणाली 0.8kW BGA; कारखाना

वाहन एलईडी लैंप के लिए फ्लेवर डिटेक्टर एक्स रे निरीक्षण प्रणाली 0.8kW BGA;

EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

गुणवत्ता PCBA के लिए पोर्टेबल 1uSv / h 90kV 0.5kW X रे निरीक्षण मशीन कारखाना

PCBA के लिए पोर्टेबल 1uSv / h 90kV 0.5kW X रे निरीक्षण मशीन

Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.

गुणवत्ता 1.6kW ऑफ़लाइन प्रोग्रामिंग Unicomp X Ray AX9100 कनेक्टर के लिए कारखाना

1.6kW ऑफ़लाइन प्रोग्रामिंग Unicomp X Ray AX9100 कनेक्टर के लिए

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Offline programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

गुणवत्ता मदरबोर्ड के लिए माइक्रोफोकस AX9100 सीएनसी मैपिंग यूनिकॉम्प एक्स रे 130kV कारखाना

मदरबोर्ड के लिए माइक्रोफोकस AX9100 सीएनसी मैपिंग यूनिकॉम्प एक्स रे 130kV

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

गुणवत्ता श्रीमती बीजीए सीएसपी के लिए 3um बंद ट्यूब 1.6kW एक्स रे मशीन कारखाना

श्रीमती बीजीए सीएसपी के लिए 3um बंद ट्यूब 1.6kW एक्स रे मशीन

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,

गुणवत्ता FPD डिटेक्टर के साथ IGBT BGA QFN X रे स्कैनर मशीन AX8200MAX कारखाना

FPD डिटेक्टर के साथ IGBT BGA QFN X रे स्कैनर मशीन AX8200MAX

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 OUR SERVICE Your inquiry will be replied in 12 hours. Original Manufacture to customers, with competitive price. We provide one year warranty, free training and whole life technology support. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you,and will give you the tracking NO. after shipment. Well-trained and Professional after-sales service team to support you. Manual will

गुणवत्ता पीसीबी/बीजीए विश्लेषण के लिए इनलाइन यूनिकॉम्प LX9200 एक्स रे निरीक्षण प्रणाली उच्च परिशुद्धता कारखाना

पीसीबी/बीजीए विश्लेषण के लिए इनलाइन यूनिकॉम्प LX9200 एक्स रे निरीक्षण प्रणाली उच्च परिशुद्धता

Inline High-Precision 3D X-Ray Tomography for PCB and BGA Analysis Unicomp LX9200 X-Ray inspection system Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge... Semiconduc