x ray inspection system
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फास्ट डिटेक्शन स्पीड PCBA डेस्कटॉप एक्स रे मशीन, इलेक्ट्रॉनिक निरीक्षण उपकरण
Benchtop Electronics PCBA X ray Machine for Cables , harnesses , plastics Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray
लिथियम बैटरी सेल कॉइल घुमावदार मिसलिग्मेंट निरीक्षण के लिए ऑफलाइन 5um माइक्रोफोकस एक्स-रे मशीन AX8200B
Offline 5um microfocus X-ray machine AX8200B for Lithium Battery cell coil winding misalighment inspection The lithium battery X-Ray detection equipment of multiple types and full automation solely-developed by Unicomp Technology is targetted to inspect cells alignment metric and tabs soldering quality . It improves automation as well as gains high-definition internal images by means of X-ray imaging technology . This technology is widely applied to the detection of lithium
ऑटोमोटिव आइडेंटिफिकेशन के साथ श्रीमती पीसीबीए इलेक्ट्रॉनिक्स एक्स रे मशीन यूनिकॉम्प हाई स्पीड इनलाइन
Unicomp High Speed inline SMT PCBA X-Ray Inspection System with Automotive Identification OK / NG Result Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
ऑटो इंडस्ट्री एनडीटी एक्स रे उपकरण हाई डेफिनिशन नॉन डिस्ट्रक्टिव टेस्टिंग लॉन्ग लाइफ
Non-Destructive Testing (NDT) servicing the requirements of the auto industry ●Strong penetration,high reliable,low breakdown, long life; ●High definition,resolution FPD; ●Multi-functional workstation,360°rotation and shift; ●High automation,fast detection speed; ●User friendly software design for interfacing and to facilitate,customize software function development requirement. For over 15 years X-Ray inspecting, a division of X-Ray industries, has been committed to
BGA CSP / QFN / PoP शून्य निरीक्षण के लिए उच्च आवर्धन इलेक्ट्रॉनिक्स X Ray सिस्टम
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
चीन एक्स-रे मशीन निर्माता यूनिकॉम्प माइक्रोफोकस 130kV एक्स-रे AX9100 PCBA IC BGA PTH के लिए 2.5D FPD तिरछा दृश्य के साथ
China X-ray machines manfuacturer Unicomp microfocus 130kV X-ray AX9100 with 2.5D FPD oblique view for PCBA IC BGA PTH Features of X-ray AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of X-ray AX9100: ● SMT, BGA, CSP,
सीएनसी प्रोग्रामेबल डिटेक्शन इलेक्ट्रॉनिक्स एक्स रे मशीन गोल्फ बॉल इनर क्वालिटी इंस्पेक्शन
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
पीसीबी BGA निरीक्षण इलेक्ट्रॉनिक्स एक्स रे मशीन गोल्फ बॉल गुणवत्ता की जाँच के अंदर
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
मोबाइल फोन PCBA के लिए 0.8kW BGA शून्य माप एक्स रे मशीन
X-Ray Inspection Machine Electronics BGA Standard Multifunction Technical Data System SummaryFootprint1080(W)×1180(D)×1730(H)mmMachine Weight1050 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size146(W)×128(D)×196(H)cmPacking Weight1160 kgPower Consumption1.0 kWX-Ray TubeTube TypeSealedMax. Power8WVoltage0~90kV (Adjustable)Focus Spot Size5μmImaging SystemDetectorFlat Panel Detector (option 4’’ i.i. Detector)Pixel Size85μmEffective Detection Area130*130mmFrame Rates20fpsPi
