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Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis

मूलभूत गुण
उत्पत्ति का स्थान: चीन
ब्रांड नाम: UNICOMP
प्रमाणन: CE, FDA
मॉडल नंबर: AX8300MAX
व्यापारिक संपत्तियाँ
न्यूनतम आदेश मात्रा: 1 सेट
कीमत: can negotiate
भुगतान की शर्तें: टी/टी, एल/सी
आपूर्ति की योग्यता: प्रति माह 30 सेट
उत्पाद सारांश
Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), ...

उत्पाद विवरण

प्रमुखता देना:

BGA solder joint X-ray machine

,

AX8300MAX auto void analyzer

,

Unicomp electronics inspection machine

Motion Control Mode: माउस और कीबोर्ड और जॉयस्टिक
Tilt And Rotation: डिटेक्टर एकतरफ़ा झुकाव अधिकतम 60°
Monitor: 27"एचडी 4K डिस्प्ले
System OS: विंडोज़11 64-बिट
Power Consumption: 900W
उत्पाद वर्णन
Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX
Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing.
Applications
This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components.
Key Features
  • Professional semiconductor inspection configuration with 5 μm ultra-high resolution
  • Extended detection scope, supporting high-efficiency batch inspection and mass production testing
  • Dual rocker mechanical design, enabling flexible and precise manual operation
  • Compatible with 2D and 2.5D detection, with expandable 3D detection function
  • Dual-screen interactive design, supporting multi-task parallel operation and improving inspection efficiency
  • Integrated dedicated AI algorithm for automated semiconductor defect detection
Technical Specifications
Product Name AX8300MAX
Dimension 1286(W)*1540(D)*1700(H)[mm]
Machine Weight 1530kg
Power Supply 220V±10% 50Hz/60Hz 4A
Detector High resolution FPD
Voltage 110kV
Power 900w
Tube Type Sealed
Max. Power 20W
Detection Area 129*129[mm]
Pixel Matrix 1536*1536[pixel]
Frame Rates Max 30fps
Geometric Magnification 47.7X
System Functions
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis 0
Inspection Sample Images
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis 1
Frequently Asked Questions
How about the package? Is it safe during delivery?
All X-ray inspection machines are packed with standard wooden solid cartons. This ensures safe shipping and delivery.
Do you provide warranty? How about the after-sales service?
1-year warranty free for spare parts with lifetime technical support. We have a professional after-sales team and provide assistant videos for troubleshooting.
If we come to your factory, will you provide free training?
Yes, we warmly welcome you to visit our factory and will arrange comprehensive free training for your team.
Our Services
  • Help customers analyze product projects and provide detection solutions
  • Provide professional detection solutions
  • Skilled jig design services
  • 24-hour feedback speed by email and other channels
  • Free sample detection testing
  • Provide shipping/delivery information checking service
  • One year guarantee with lifetime maintenance promise
समग्र रेटिंग
5.0
★★★★★
★★★★★
हाल ही में 50 समीक्षाओं पर आधारित
5 सितारा
100%
4 सितारा
0
3 स्टार
0
2 सितारा
0
1 सितारा
0
सभी समीक्षाएँ
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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