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घर / उत्पाद / इलेक्ट्रॉनिक्स एक्स रे मशीन / Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor
गुणवत्ता Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor कारखाना
गुणवत्ता Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor कारखाना
गुणवत्ता Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor कारखाना
गुणवत्ता Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor कारखाना
गुणवत्ता Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor कारखाना

Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor

मूलभूत गुण
उत्पत्ति का स्थान: चीन
ब्रांड नाम: UNICOMP
प्रमाणन: CE, FDA
मॉडल नंबर: AX9100मैक्स
व्यापारिक संपत्तियाँ
न्यूनतम आदेश मात्रा: 1 सेट
कीमत: can negotiate
भुगतान की शर्तें: एल/सी,टी/टी
आपूर्ति की योग्यता: प्रति माह 30 सेट
टैग

x ray equipment

electronics x ray system

electronic inspection equipment
उत्पाद सारांश
AX9100MAX Semiconductor X-Ray Inspection System Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components with micro-focus 2D/2.5D imaging ...

उत्पाद विवरण

प्रमुखता देना:

Micro-focus 2D PCBA defect checking

,

2.5D imaging semiconductor X-ray machine

,

UNICOMP AX9100MAX QFP inspection
Machine Type: सेमीकंडक्टर इलेक्ट्रॉनिक एक्स-रे निरीक्षण प्रणाली
Model: AX9100मैक्स
Footprint: 1450(डब्ल्यू)×1765(डी)×1835(एच)मिमी
Max.Power: 65W
X-Ray Tube Type: सीलबंद प्रकार
Pixel Size: 84μM
Pixel: 1536*1536
System Magnification: 1600X
उत्पाद वर्णन
AX9100MAX Semiconductor X-Ray Inspection System Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components with micro-focus 2D/2.5D imaging technology. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive
समग्र रेटिंग
5.0
★★★★★
★★★★★
हाल ही में 50 समीक्षाओं पर आधारित
5 सितारा
100%
4 सितारा
0
3 स्टार
0
2 सितारा
0
1 सितारा
0
सभी समीक्षाएँ
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE

Mr. James Lee

Marketing Director

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