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Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection

मूलभूत गुण
उत्पत्ति का स्थान: चीन
ब्रांड नाम: UNICOMP
प्रमाणन: CE, FDA
मॉडल नंबर: AX8300MAX
व्यापारिक संपत्तियाँ
न्यूनतम आदेश मात्रा: 1 सेट
कीमत: can negotiate
भुगतान की शर्तें: टी/टी, एल/सी
आपूर्ति की योग्यता: प्रति माह 30 सेट
उत्पाद सारांश
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable ...

उत्पाद विवरण

प्रमुखता देना:

Unicomp AX8300MAX X-ray inspection machine

,

BGA automated void detection X-ray

,

110KV X-ray machine for electronics

Motion Control Mode: माउस और कीबोर्ड और जॉयस्टिक
Tilt And Rotation: डिटेक्टर एकतरफ़ा झुकाव अधिकतम 60°
Monitor: 27"एचडी 4K डिस्प्ले
System OS: विंडोज़11 64-बिट
Power Consumption: 900W
उत्पाद वर्णन
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and
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