bga x ray inspection system
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उच्च संकल्प इमेजिंग चेन के साथ एकीकृत जेनरेटर श्रीमती / ईएमएस एक्स रे मशीन
Metal X Ray Machine with integrated generator & a high-resolution imaging chain The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
EMS ऑटोमोटिव PCBA BGA QFN CSP सोल्डरिंग दोष निरीक्षण के लिए Unicomp AX8200MAX 5um माइक्रोफोकस एक्स-रे मशीन
Unicomp AX8200MAX 5um microfocus X-Ray machine for EMS Automotive PCBA BGA QFN CSP soldering defects Inspection Specification Of Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
SMT BGA QFP PoP पैकेज के लिए सीएनसी प्रोग्रामेबल 1.0 kW X रे मशीन
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
श्रीमती बीजीए सोल्डरिंग के लिए 0.8kW 5um एफडीए इलेक्ट्रॉनिक्स एक्स रे मशीन
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. System
एसएमटी बीजीए पीसीबी एफपीसी के लिए एफपीडी 100 केवी एक्स रे इमेज डिटेक्टर AX8200
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection Item Definition Specs System Parameters Size 1080(L
बीजीए सोल्डरिंग बॉल की जांच के लिए 5 माइक्रोन फोकस एक्स-रे ट्यूब के साथ रियल-टाइम एक्स-रे मशीन
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
PCBA निरीक्षण के लिए फाइनफोकस ट्यूब 100KV X रे स्कैनर AX8200
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. Technical Data
इलेक्ट्रॉनिक घटकों के आंतरिक दोष निरीक्षण के लिए AX8200max यूनिकॉम्प एक्स-रे प्रणाली
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Specification Of SMT X-Ray machine Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector
AX8200max पीसीबी एक्स रे मशीन 90kV निरीक्षण प्रभाव के लिए ±60° झुकाने के कार्य के साथ
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Application Fields of SMT X-Ray machine Unicomp AX8200MAX BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, Other Special Industries. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive
