bga x ray inspection system
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क्लियर इमेजिंग बीजीए वॉयड डिटेक्शन पीसीबीए बीजीए एक्स-रे AX9600 यूनिकॉम्प एसएमटी पीसीबी असेंबली इंस्पेक्शन सिस्टम
Clear Imaging BGA Void Detection PCBA BGA X-ray AX9600 Unicomp SMT PCB Assembly Inspection System UNICOMP AX9600 adopts an in-house developed 160kV high-power open micro-focus X-ray tube with an ultra-fine 0.8μm focal spot. It supports magnification up to 2000× and offers superior X-ray penetration, enabling precise void content measurement for TVS diodes. Optimized for high-end semiconductor inspection, it caters to high-precision quality control of advanced IC packaging,
श्रीमती चिपसेट प्रतिरोध इलेक्ट्रॉनिक निरीक्षण उपकरण AX8200 X-Ray बंद 5 जी
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
सीई एफडीए के साथ एलईडी पट्टी सोल्डरिंग 90 केवी बंद ट्यूब पीसीबी एक्स रे मशीन;
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 OUR SERVICE Your inquiry will be replied in 12 hours. Original Manufacture to customers, with competitive price. We provide one year warranty, free training and whole life technology support. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you,and will give you the tracking NO. after shipment. Well-trained and Professional after-sales service team to support you. Manual will
पीसीबीए रीफ्लो सोल्डरिंग के लिए 100KV इलेक्ट्रॉनिक्स एक्स रे मशीन 0.8kW
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Unicomp AX8200B बटन लिथियम बैटरी एक्स रे मशीन 5um फोकस साइज 90kV सील ट्यूब
Unicomp 5um 90kV sealed tube X-Ray Inspection Machine AX8200B for button Lithium battery inspection Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process
एकाधिक माप उपकरण के साथ यूनिकॉम्प एक्स-रे सिस्टम AX8200max
Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
AX8200max इलेक्ट्रॉनिक्स एक्स रे मशीन 6 अक्ष 360 डिग्री रोटेशन के साथ वैकल्पिक
Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
BGA निरीक्षण एक्स रे उपकरण 22 "एलसीडी विथ सीएनसी प्रोग्रामेबल डिटेक्शन फंक्शन
Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC programmable detection Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient
डेस्कटॉप BGA Voids 90kV 8W इलेक्ट्रॉनिक्स एक्स रे मशीन 22 "एलसीडी
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22" LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
